Insulated surface mount circuit board construction
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United States of America Patent
Stats
-
Mar 25, 1997
Issued Date -
N/A
app pub date -
Nov 3, 1995
filing date -
Aug 18, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.
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