BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate
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United States of America Patent
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Mar 25, 1997
Grant Date -
N/A
app pub date -
Jul 24, 1995
filing date -
Jul 26, 1994
priority date (Note) -
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Abstract
A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package body having a first part for embedding the semiconductor chips on the upper major surface of the first substrate and a second part for embedding the semiconductor chips on the lower major surface of the first substrate, wherein the second substrate carries on a lower major surface thereof solder bumps forming a BGA structure.
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