Method of manufacturing an integrated package having a pair of die on a common lead frame
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United States of America Patent
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Apr 1, 1997
Issued Date -
N/A
app pub date -
Aug 21, 1995
filing date -
Jan 30, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
This invention is for an integrated circuit package which includes two integrated circuit die connected to a common substantially planar lead frame, wherein bond pads on each die face the common lead frame.
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