Method for interconnecting a flip chip to a printed circuit substrate
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United States of America Patent
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-
Apr 1, 1997
Issued Date -
N/A
app pub date -
May 10, 1996
filing date -
Sep 6, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit assembly and a method of manufacturing therefor are provided for directly connecting unpackaged integrated circuit chips such as flip chips to a footprint of active contact pads on a printed circuit substrate. A reduction in packaging density is obtained by electrically interconnecting one or more of the active contact pads with circuit traces formed on different layers of the printed circuit substrate. In a preferred embodiment, at least one of the active contact pads includes an electrically conductive through hole electrically connecting the contact pad and a circuit trace located on the back side of a double-sided printed circuit substrate. In another embodiment, the printed circuit substrate is a multilayer construction, which enables active contact pads to be electrically interconnected with circuit traces on a plurality of circuit layers.
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