Use of multiple anodes in a magnetron for improving the uniformity of its plasma
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United States of America Patent
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Apr 1, 1997
Grant Date -
N/A
app pub date -
Mar 23, 1994
filing date -
Mar 23, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In one group of embodiments, two or more small anodes are spaced apart from one another in a magnetron, with some aspect of their electrical power being individually controlled in a manner to control a density profile across a plasma. In another group of embodiments, the same effect is obtained by mechanically moving one or more small anodes or anode masks. When used in a magnetron having either a rotating cylindrical cathode or a stationary planar cathode and designed to sputter films of material onto a substrate, the uniformity of the rate of deposition across the substrate is improved. Also, adverse effects of sputtering dielectric materials are reduced.
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