Method for direct-electroplating an electrically nonconductive substrate
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United States of America Patent
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Apr 1, 1997
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N/A
app pub date -
Jan 20, 1995
filing date -
May 24, 1993
priority date (Note) -
Expired
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Abstract
A process for plating an electrically nonconductive substrate by the following sequence of steps: (1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent; (2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant; (3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives; (4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and (5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4). With this process, improved productivity is obtained through process simplification, reduced treating time and improved working environment.
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