Method of manufacturing sensor
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United States of America Patent
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Apr 1, 1997
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N/A
app pub date -
Apr 2, 1996
filing date -
May 6, 1993
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Abstract
A method for manufacturing sensors from a multilayer plate with upper and lower monocrystalline silicon layers and an etching layer between them. The upper silicon layer is structured by the introduction of troughs therein extending down to the etching layer. Sensor structures, such as a bending beam that is used in an acceleration sensor, are created by etching the etching layer beneath a part of the silicon layer structured in this manner.
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