Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof
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United States of America Patent
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Apr 8, 1997
Grant Date -
N/A
app pub date -
May 31, 1995
filing date -
May 31, 1995
priority date (Note) -
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Abstract
A method of immobilizing both (i) a semiconductor wafer (16) during the sawing thereof to form individual chips (18) and (ii) the resulting chips (18) as and after sawing of the wafer (16) is completed. A negative pressure is applied to the wafer (16) through a wafer carrier (12) to immobilize the wafer and individual chips. The negative pressure is applied to the wafer via ports (30) in alignment with the location of each chip (18) to be formed. A grid (40) or negative pressure is used to restrain the chips as they are subsequently transported following sawing.
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