Semiconductor device package side-by-side stacking and mounting system
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United States of America Patent
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Apr 8, 1997
Grant Date -
N/A
app pub date -
May 2, 1994
filing date -
May 2, 1994
priority date (Note) -
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Abstract
The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space. The casing dissipates heat generated in the devices, and may be of metal or thermally conductive plastic.
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