Method for fabricating highly conductive vias
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 15, 1997
Issued Date -
N/A
app pub date -
Apr 28, 1995
filing date -
Jun 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.
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