Method and apparatus for heat-treating substrate
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United States of America Patent
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Apr 15, 1997
Grant Date -
N/A
app pub date -
Oct 3, 1995
filing date -
Oct 5, 1994
priority date (Note) -
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Abstract
A heat-treating method of heating and cooling a substrate comprising the steps of carrying the wafer into a heat-treating section by a main arm and mounting the wafer on a heating stage, heating the wafer mounted on the heating stage, lifting the wafer thus heated from the heating stage, approaching a cooling holder to the wafer thus lifted to cool the wafer above the heating stage, and carrying the cooled wafer from above the heating stage.
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