All ceramic surface mount sip and dip networks having spacers and solder barriers
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United States of America Patent
Stats
-
Apr 15, 1997
Issued Date -
N/A
app pub date -
May 19, 1995
filing date -
Oct 25, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.
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