Process for manufacturing a resin molded image pick-up semiconductor chip having a window
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United States of America Patent
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Apr 22, 1997
Grant Date -
N/A
app pub date -
Jan 23, 1995
filing date -
Jan 24, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A process for packaging a solid type image pick-up device and a device produced by the packaging process. The process includes the steps of: forming a protecting layer on a light receiving region of an image pick-up chip formed on a semiconductor wafer; separating the image pick-up chip after forming the protecting layer; attaching the image pick-up chip on a lead frame and connecting leads of the lead frame to a pad of the separated image pick-up chip; sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer; and removing the protecting layer, and sealing a transparent plate on a cavity formed by the projection.
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