Process of making an integrated circuit chip composite including parylene coated wire

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5622898
SERIAL NO

08445381

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY45596

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zechman, John H Endicott, NY 1 17

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
* 5045151 Micromachined bonding surfaces and method of forming the same 24 1989
 
Other [Check patent profile for assignment information] (3)
* 4401053 Coating fixture 11 1981
* 4486945 Method of manufacturing semiconductor device with plated bump 53 1982
* 4945856 Parylene deposition chamber 35 1988
 
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (1)
* 4581291 Microminiature coaxial cable and methods manufacture 23 1983
 
Thomson-CSF (1)
* 5323533 Method of producing coaxial connections for an electronic component, and component package 28 1992
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5016084 Semiconductor device 29 1990
 
GODO KAISHA IP BRIDGE 1 (1)
* 2006/0262,987 Variable length coding method and variable length decoding method 0 2006
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 5824568 Process of making an integrated circuit chip composite 31 1996
 
THE REGENTS OF THE UNIVERSITY OF MICHIGAN (4)
7790493 Wafer-level, polymer-based encapsulation for microstructure devices 8 2006
* 2007/0007,240 Wafer-level, polymer-based encapsulation for microstructure devices 11 2006
8193645 Wafer-level, polymer-based encapsulation for microstructure devices 0 2010
* 2010/0308,456 Wafer-Level, Polymer-Based Encapsulation for Microstructure Devices 2 2010
 
Rosenberger Hochfrequenztechnick GmbH & Co. KG (1)
8839508 Method of making a high frequency device package 1 2011
 
MICRON TECHNOLOGY, INC. (1)
* 6445060 Coated semiconductor die/leadframe assembly and method for coating the assembly 7 2000
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
8203219 Electrically enhanced wirebond package 3 2007
 
STI Electronics, Inc. (1)
* 7116557 Imbedded component integrated circuit assembly and method of making same 14 2003
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (2)
* 8235002 Plasma assisted apparatus for organic film deposition 0 2008
* 2009/0133,622 PLASMA ASSISTED APPARATUS FOR ORGANIC FILM DEPOSITION 2 2008
 
NIPPON STEEL CORPORATION (1)
* 2002/0113,322 Semiconductor device and method to produce the same 7 2001
 
REMEC BROADBAND WIRELESS HOLDINGS, INC. (1)
6667549 Micro circuits with a sculpted ground plane 7 2002
 
INFINEON TECHNOLOGIES AG (2)
* 6852567 Method of assembling a semiconductor device package 49 2002
* 2015/0001,700 Power Modules with Parylene Coating 1 2013
 
MACOM CONNECTIVITY SOLUTIONS, LLC (1)
* 8377749 Integrated circuit transmission line 2 2009
 
HUGHES ELECTRONICS CORPORATION (1)
* 6573124 Preparation of passivated chip-on-board electronic devices 4 1999
 
SANDIA CORPORATION (1)
6956283 Encapsulants for protecting MEMS devices during post-packaging release etch 81 2003
 
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG (6)
* 6770822 High frequency device packages and methods 74 2002
7520054 Process of manufacturing high frequency device packages 2 2002
* 2003/0168,250 High frequency device packages and methods 6 2002
8581113 Low cost high frequency device package and methods 0 2007
* 2009/0159,320 Low Cost High Frequency Device Package and Methods 13 2007
9275961 Low cost high frequency device package and methods 0 2012
* Cited By Examiner