US Patent No: 5,622,898

Number of patents in Portfolio can not be more than 2000

Process of making an integrated circuit chip composite including parylene coated wire

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Abstract

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A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY75111

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zechman, John H Endicott, NY 1 15

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
4,323,914 Heat transfer structure for integrated circuit package 152 1979
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,045,151 Micromachined bonding surfaces and method of forming the same 24 1989
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,016,084 Semiconductor device 29 1990
 
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (1)
4,581,291 Microminiature coaxial cable and methods manufacture 21 1983
 
Thomson-CSF (1)
5,323,533 Method of producing coaxial connections for an electronic component, and component package 26 1992
 
UNWIRED PLANET, LLC (1)
2001/0001,008 Transmitter/receiver for GMSK and Offset-QAM 9 2000
 
Other [Check patent profile for assignment information] (3)
4,401,053 Coating fixture 11 1981
4,486,945 Method of manufacturing semiconductor device with plated bump 53 1982
4,945,856 Parylene deposition chamber 33 1988

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG (3)
6,770,822 High frequency device packages and methods 61 2002
7,520,054 Process of manufacturing high frequency device packages 1 2002
8,581,113 Low cost high frequency device package and methods 0 2007
 
THE REGENTS OF THE UNIVERSITY OF MICHIGAN (2)
7,790,493 Wafer-level, polymer-based encapsulation for microstructure devices 3 2006
8,193,645 Wafer-level, polymer-based encapsulation for microstructure devices 0 2010
 
APPLIED MICRO CIRCUITS CORPORATION (1)
8,377,749 Integrated circuit transmission line 0 2009
 
HUGHES ELECTRONICS CORPORATION (1)
6,573,124 Preparation of passivated chip-on-board electronic devices 3 1999
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
8,235,002 Plasma assisted apparatus for organic film deposition 0 2008
 
INFINEON TECHNOLOGIES AG (1)
6,852,567 Method of assembling a semiconductor device package 23 2002
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,824,568 Process of making an integrated circuit chip composite 29 1996
 
MICRON TECHNOLOGY, INC. (1)
6,445,060 Coated semiconductor die/leadframe assembly and method for coating the assembly 6 2000
 
REMEC BROADBAND WIRELESS HOLDINGS, INC. (1)
6,667,549 Micro circuits with a sculpted ground plane 6 2002
 
SANDIA CORPORATION (1)
6,956,283 Encapsulants for protecting MEMS devices during post-packaging release etch 53 2003
 
STI Electronics, Inc. (1)
7,116,557 Imbedded component integrated circuit assembly and method of making same 6 2003
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
8,203,219 Electrically enhanced wirebond package 1 2007

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