Membrane probing of circuits
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United States of America Patent
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Apr 22, 1997
Issued Date -
N/A
app pub date -
May 6, 1996
filing date -
Sep 9, 1994
priority date (Note) -
Expired
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Abstract
First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source,
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