Vortex tube cooling system for solder reflow convection furnaces
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United States of America Patent
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Apr 29, 1997
Grant Date -
N/A
app pub date -
Jan 17, 1996
filing date -
Jan 17, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vortex tube cooling system is presented. The cooling system contains one or more vortex tubes connected to a supply of compressed gas, the vortex tubes providing a stream of cold gas which cools product as it emerges from a furnace. The cooling system is particularly useful for cooling circuit boards emerging from a solder reflow convection furnace.
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