Semiconductor device in a resin package housed in a frame having high thermal conductivity
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United States of America Patent
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Apr 29, 1997
Grant Date -
N/A
app pub date -
Jul 27, 1994
filing date -
Nov 18, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
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