Apparatus and method for developing resist coated on a substrate
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United States of America Patent
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Apr 29, 1997
Grant Date -
N/A
app pub date -
Sep 28, 1995
filing date -
Sep 29, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A developing apparatus comprising a spin chuck for rotating a wafer while keeping the wafer substantially horizontal with a resist-coated surface up, a nozzle for supplying developer, from above and obliquely, to the resist-coated surface of the wafer on the sign chuck, a source for supplying the developer to the nozzle, a cup arranged enclosing a peripheral portion of the wafer on the spin chuck and having a drain passage through which the developer supplied to the wafer is drained, and a belt drive mechanism for moving the nozzle in a horizontal plane to discharge the developer to the wafer in such a direction that follows the wafer rotating.
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