Transfer molding machine for encapsulation of semiconductor devices
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United States of America Patent
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May 6, 1997
Grant Date -
N/A
app pub date -
Feb 21, 1995
filing date -
Feb 21, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.
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