Method of making silicon quantum wires

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United States of America Patent

PATENT NO 5627382
SERIAL NO

08457596

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Abstract

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A method of making semiconductor quantum wires, and a light emitting device employing such wires, employs a semiconductor wafer as starting material. The wafer is weakly doped p type with a shallow heavily doped p layer therein for current flow uniformity purposes. The wafer is anodized in 20% aqueous hydrofluoric acid to produce a layer 5 microns thick with 70% porosity and good crystallinity. The layer is subsequently etched in concentrated hydrofluoric acid, which provides a slow etch rate. The etch increases porosity to a level in the region of 80% or above. At such a level, pores overlap and isolated quantum wires are expected to form with diameters less than or equal to 3 nm. When excited, the etched layer exhibits photoluminescence emission at photon energies well above the silicon bandgap (1.1 eV) and extending into the red region (1.6-2.0 eV) of the visible spectrum.

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Patent Owner(s)

Patent OwnerAddress
PAMERA MANAGEMENT CO LLC160 GREENTREE DRIVE SUITE 101 DOVER DE 19904

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Canham, Leigh-Trevor Worcestershire, GB2 5 93
Keen, John M Worcestershire, GB2 5 159
Leong, Weng Y Worcestershire, GB2 8 168

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