Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer
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United States of America Patent
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May 6, 1997
Grant Date -
N/A
app pub date -
Jul 17, 1995
filing date -
Jul 17, 1995
priority date (Note) -
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Importance
Abstract
An integrated circuit assembly includes an integrated circuit chip having a plurality of input/output terminals arranged at a surface thereof, and an electrically conductive layer connected to such surface of the integrated circuit chip. The layer is electrically conductive in thickness and electrically insulative in width and length. The assembly may further include a dielectric substrate connected to the layer such that the layer electrically connects respective terminals of the integrated circuit chip to respective electrically conductive traces of the dielectric substrate. An array of contacts may be electrically connected to the traces of the dielectric substrate.
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