Inverted chip bonded module with high packaging efficiency

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5627406
SERIAL NO

08689388

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NETWORK PROTECTION SCIENCES, LLCRONKONKOMA, NY6

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pace, Benedict G 2200 Smithtown Ave., Ronkonkoma, NY 11779 13 486

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (27)
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* Cited By Examiner