US Patent No: 5,627,406

Number of patents in Portfolio can not be more than 2000

Inverted chip bonded module with high packaging efficiency

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Abstract

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An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NETWORK PROTECTION SCIENCES, LLCRONKONKOMA, NY9

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pace, Benedict G Shoreham, NY 14 447

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,216,278 Semiconductor device having a pad array carrier package 544 1992
 
INTEGRATED SYSTEM ASSEMBLIES CORPORATION, A CORP. OF DE (1)
5,111,278 Three-dimensional multichip module systems 235 1991
 
PACESETTER, INC. (1)
4,614,194 Implantable pulse generator having a single printed circuit board for carrying integrated circuit chips thereon with chip carrier means 61 1984
 
SILICON POWER CORPORATION (1)
5,166,773 Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid 31 1989
 
STOVOKOR TECHNOLOGY LLC (1)
5,265,321 Integrated circuit structure with heat exchanger elements secured thereto and method of making 20 1992

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Bridge Semiconductor Corporation (47)
6,537,851 Method of connecting a bumped compliant conductive trace to a semiconductor chip 5 2001
6,673,710 Method of connecting a conductive trace and an insulative base to a semiconductor chip 7 2001
6,667,229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip 5 2001
6,492,252 Method of connecting a bumped conductive trace to a semiconductor chip 22 2001
6,800,506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly 7 2002
6,583,040 Method of making a pillar in a laminated structure for a semiconductor chip assembly 10 2002
6,740,576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly 52 2002
6,608,374 Semiconductor chip assembly with bumped conductive trace 7 2002
7,264,991 Method of connecting a conductive trace to a semiconductor chip using conductive adhesive 6 2002
6,699,780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching 10 2002
6,809,414 Semiconductor chip assembly with bumped conductive trace 17 2002
6,984,576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip 3 2003
6,949,408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 2 2003
6,908,788 Method of connecting a conductive trace to a semiconductor chip using a metal base 4 2003
6,872,591 Method of making a semiconductor chip assembly with a conductive trace and a substrate 10 2003
6,876,072 Semiconductor chip assembly with chip in substrate cavity 18 2003
7,190,080 Semiconductor chip assembly with embedded metal pillar 25 2003
7,094,676 Semiconductor chip assembly with embedded metal pillar 10 2003
7,009,297 Semiconductor chip assembly with embedded metal particle 28 2004
7,015,128 Method of making a semiconductor chip assembly with an embedded metal particle 12 2004
7,067,911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture 36 2004
7,129,113 Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture 17 2004
7,071,573 Semiconductor chip assembly with welded metal pillar 10 2004
7,132,741 Semiconductor chip assembly with carved bumped terminal 25 2004
7,129,575 Semiconductor chip assembly with bumped metal pillar 11 2004
7,112,521 Method of making a semiconductor chip assembly with a bumped metal pillar 4 2004
7,071,089 Method of making a semiconductor chip assembly with a carved bumped terminal 6 2004
7,319,265 Semiconductor chip assembly with precision-formed metal pillar 7 2005
7,075,186 Semiconductor chip assembly with interlocked contact terminal 8 2005
7,232,706 Method of making a semiconductor chip assembly with a precision-formed metal pillar 6 2005
7,232,707 Method of making a semiconductor chip assembly with an interlocked contact terminal 6 2005
7,414,319 Semiconductor chip assembly with metal containment wall and solder terminal 4 2005
7,419,851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal 4 2005
7,268,421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond 6 2006
7,262,082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture 53 2006
7,993,983 Method of making a semiconductor chip assembly with chip and encapsulant grinding 1 2006
7,750,483 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal 5 2006
7,446,419 Semiconductor chip assembly with welded metal pillar of stacked metal balls 4 2006
7,425,759 Semiconductor chip assembly with bumped terminal and filler 2 2006
7,396,703 Method of making a semiconductor chip assembly with a bumped terminal and a filler 2 2006
7,932,165 Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base 1 2006
7,453,140 Semiconductor chip assembly with laterally aligned filler and insulative base 1 2006
7,417,314 Semiconductor chip assembly with laterally aligned bumped terminal and filler 14 2006
7,494,843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding 2 2006
7,538,415 Semiconductor chip assembly with bumped terminal, filler and insulative base 9 2007
7,833,827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base 1 2007
7,811,863 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment 2 2009
 
FormFactor, Inc. (8)
5,917,707 Flexible contact structure with an electrically conductive shell 302 1994
6,049,976 Method of mounting free-standing resilient electrical contact structures to electronic components 123 1995
7,084,656 Probe for semiconductor devices 8 1996
6,215,670 Method for manufacturing raised electrical contact pattern of controlled geometry 99 1999
6,538,214 Method for manufacturing raised electrical contact pattern of controlled geometry 77 2001
6,818,840 Method for manufacturing raised electrical contact pattern of controlled geometry 67 2002
7,082,682 Contact structures and methods for making same 1 2004
7,200,930 Probe for semiconductor devices 11 2005
 
HYNIX SEMICONDUCTOR INC. (6)
6,927,471 Electronic system modules and method of fabrication 32 2002
6,881,609 Component connections using bumps and wells 45 2003
7,297,572 Fabrication method for electronic system modules 10 2003
7,615,478 Fabrication method for electronic system modules 2 2007
7,723,156 Electronic system modules and method of fabrication 0 2007
8,252,635 Electronic system modules and method of fabrication 0 2010
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
5,966,633 Method for providing a metallization layer on an insulating layer and for opening through holes in the said insulating layer using the same mask 4 1996
6,541,865 Porous dielectric material and electronic devices fabricated therewith 16 2001
7,855,442 Silicon based package 3 2007
7,892,635 Precursors for porous low-dielectric constant materials for use in electronic devices 0 2008
 
SALMON TECHNOLOGIES, LLC (4)
7,505,862 Apparatus and method for testing electronic systems 0 2003
7,408,258 Interconnection circuit and electronic module utilizing same 1 2004
7,427,809 Repairable three-dimensional semiconductor subsystem 11 2004
7,586,747 Scalable subsystem architecture having integrated cooling channels 8 2006
 
DATA DEVICE CORPORATION (3)
6,613,605 Interconnection method entailing protuberances formed by melting metal over contact areas 11 2000
7,132,356 Interconnection method 1 2003
7,271,028 High density electronic interconnection 6 2004
 
The Goodyear Tire & Rubber Company (3)
6,534,711 Encapsulation package and method of packaging an electronic circuit module 151 2000
6,543,279 Pneumatic tire having transponder and method of measuring pressure within a pneumatic tire 28 2000
6,412,977 Method for measuring temperature with an integrated circuit device 39 2000
 
IBIDEN CO., LTD. (2)
8,698,303 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device 0 2011
8,785,255 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device 0 2014
 
LIN, CHARLES W.C. (2)
6,437,452 Bumpless flip chip assembly with strips-in-via and plating 2 1999
6,316,830 Bumpless flip chip assembly with strips and via-fill 14 1999
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
6,429,114 Method for fabricating a multilayer ceramic substrate 12 1998
6,861,744 Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths 1 2002
 
SK HYNIX INC. (2)
8,581,407 Electronic system modules and method of fabrication 0 2009
8,633,584 Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well 1 2009
 
UNIMICRON TECHNOLOGY CORP. (2)
7,906,850 Structure of circuit board and method for fabricating same 4 2006
8,709,940 Structure of circuit board and method for fabricating the same 0 2011
 
ADVANCED MICRO DEVICES, INC. (1)
7,513,035 Method of integrated circuit packaging 2 2006
 
Charles W.C. Lin. (1)
6,448,644 Flip chip assembly with via interconnection 20 1998
 
Grumman Aerospace Corporation (1)
5,717,247 Microcircuit via interconnect 19 1996
 
HONEYWELL INTERNATIONAL INC. (1)
6,927,098 Methods and apparatus for attaching MEMS devices to housing 2 2003
 
INFINEON TECHNOLOGIES AG (1)
6,930,383 Electronic component including a housing and a substrate 1 2002
 
LAM RESEARCH CORPORATION (1)
6,696,366 Technique for etching a low capacitance dielectric layer 42 1999
 
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (1)
7,253,029 Non-magnetic, hermetically-sealed micro device package 0 2004
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,519,728 Semiconductor integrated circuit having test circuit 9 1999
 
MITSUBISHI ELECTRIC & ELECTRONICS USA, INC. (1)
6,576,493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 17 2002
 
MURATA MANUFACTURING CO., LTD. (1)
6,974,916 Laminated ceramic electronic component having via-hole conductors with different sectional sizes 2 2001
 
NETWORK PROTECTION SCIENCES, LLC (1)
5,793,105 Inverted chip bonded with high packaging efficiency 23 1997
 
SPINESMITH PARTNERS, L.P. (1)
7,459,385 Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler 2 2006
 
ULTRATECH, INC. (1)
6,059,173 Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board 9 1998
 
Other [Check patent profile for assignment information] (25)
6,562,657 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 11 2000
6,551,861 Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive 8 2000
6,402,970 Method of making a support circuit for a semiconductor chip assembly 12 2000
6,350,633 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 28 2000
6,350,386 Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly 22 2000
6,350,632 Semiconductor chip assembly with ball bond connection joint 14 2000
6,448,108 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 14 2000
6,440,835 Method of connecting a conductive trace to a semiconductor chip 22 2000
6,444,489 Semiconductor chip assembly with bumped molded substrate 19 2000
6,653,170 Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit 45 2001
6,528,891 Bumpless flip chip assembly with solder via 19 2001
6,475,833 Bumpless flip chip assembly with strips and via-fill 5 2001
6,406,939 Flip chip assembly with via interconnection 17 2001
6,403,400 Bumpless flip chip assembly with strips-in-via and plating 8 2001
6,660,626 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 17 2001
6,562,709 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 27 2001
6,511,865 Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly 8 2001
6,653,217 Method of connecting a conductive trace to a semiconductor chip 20 2001
6,544,813 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 11 2001
6,436,734 Method of making a support circuit for a semiconductor chip assembly 6 2001
6,403,460 Method of making a semiconductor chip assembly 9 2001
6,548,393 Semiconductor chip assembly with hardened connection joint 8 2001
6,576,539 Semiconductor chip assembly with interlocked conductive trace 23 2001
6,627,824 Support circuit with a tapered through-hole for a semiconductor chip assembly 15 2001
6,653,742 Semiconductor chip assembly with interlocked conductive trace 6 2002