Halogen tin composition and electrolytic plating process
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United States of America Patent
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May 13, 1997
Grant Date -
N/A
app pub date -
Nov 24, 1995
filing date -
Nov 24, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A composition of matter for electrolytically depositing a tin layer on an iron containing-substrate is disclosed comprising an acidic aqueous mixture of: (a) a stannous tin halide; and (b) a salt having (1) an alkaline cation, and (2) an oxygen-containing inorganic acid anion reducible to a lower oxidation state. The salt is selected to minimize oxidation of Sn (II) to Sn (IV). An electrolytic cell for electrolytically depositing a tin layer on an iron-containing substrate is also disclosed, where the cell has an electrolyte comprising the foregoing composition. The overall cell potential of the cell is decreased, and the free energy increased, compared to an electrolytic cell without the salt. A process is disclosed for depositing a tin layer on an iron containing substrate comprising electrolytically coating the substrate with the composition, or coating the substrate employing the foregoing electrolytic cell. A product made by any of the foregoing processes is also described.
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