Flip-chip semiconductor devices having two encapsulants
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United States of America Patent
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May 13, 1997
Grant Date -
N/A
app pub date -
Aug 7, 1995
filing date -
Aug 15, 1994
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor chip which is connected to a circuit substrate via solder bumps by flip-chip connection, a first encapsulant having a large Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the central portion of the semiconductor chip, and a second encapsulant having a small Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the peripheral portion of the semiconductor chip. A method for manufacturing the semiconductor device includes flowing the second encapsulant into position, but not the first encapsulant.
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