Metal ball grid array package with improved thermal conductivity
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United States of America Patent
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May 13, 1997
Grant Date -
N/A
app pub date -
Jul 19, 1994
filing date -
Jul 19, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.
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