Laser scoring of packaging substrates
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United States of America Patent
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May 20, 1997
Issued Date -
N/A
app pub date -
Jul 5, 1994
filing date -
Jul 9, 1990
priority date (Note) -
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Abstract
Packaging machinery alignment, and a package having tear initiation and tear control, result from laser scoring of the package substrate, particularly, by providing at least two substantially parallel, substantially straight or linear, laser scores across the entire width of such package substrate.
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