Device for pressurizing a plate bundle, especially for a plate heat exchanger
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United States of America Patent
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May 20, 1997
Grant Date -
N/A
app pub date -
Apr 28, 1995
filing date -
Apr 29, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A device for pressurizing a plate bundle which is arranged in a leakproof vessel (2) and comprises a stack of plates which are parallel to one another to form a first circulation circuit for a first fluid under pressure and a second circulation circuit for a second fluid under pressure. The device includes a first conduit (15) for connecting the vessel (2) to the delivery (10) of the first fluid continuously feeding the vessel (2), a second conduit (16) for connecting the vessel (2) to the delivery (12) of the second fluid feeding the vessel (2) in the event of stoppage of the delivery of the first fluid, and controls (20) for feeding of the vessel (2) with the second fluid.
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