Method for connecting a die to electrically conductive traces on a flexible lead-frame
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United States of America Patent
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May 20, 1997
Issued Date -
N/A
app pub date -
May 15, 1995
filing date -
Aug 27, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.
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