Uses of uniaxially electrically conductive articles
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United States of America Patent
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May 20, 1997
Issued Date -
N/A
app pub date -
Jan 3, 1995
filing date -
Feb 5, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phylenediamine, preferably p-phenylenediamine).
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