No coat backside wafer grinding process
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United States of America Patent
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-
May 27, 1997
Grant Date -
N/A
app pub date -
Jun 29, 1995
filing date -
Jun 29, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A silicon wafer grinding apparatus for grinding a backside surface of a semiconductor wafer that includes integrated circuit chips patterned on a frontside surface of the wafer. The apparatus includes a plurality of chuck tables that secure a plurality of wafers to be ground. Each chuck table includes a cushioned rubber pad secured to the table and an interface with the frontside surface of the wafer. An organic acid cooling fluid is utilized during the grinding procedure to prevent silicon particles and residue from being adhered to the metal bond pads of the integrated circuit chips.
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