Multilayer wiring structure for attaining high-speed signal propagation
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United States of America Patent
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May 27, 1997
Grant Date -
N/A
app pub date -
Jul 25, 1995
filing date -
Jul 26, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers are isolated from each other by insulating layers. The signal wiring layer has wires which are arranged in parallel with the parallel strip-shaped conductors of the conductor pattern of the power supply layer, and the signal wiring layer has wires which are arranged in parallel with the parallel strip-shaped conductors of the conductor pattern of the ground layer.
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