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Abstract

A compression glass lead-in arrangement in a metal body, especially in metal housings for semiconductors, in particular integrated circuits. The lead-through arrangements hermetically seal the interior of the housing relative to the environment. A glass bead is fused into a bore in the housing and the connecting conductor of the integrated circuit is passed outwardly through the glass. Alloys of the systems Cu, Al and Mg, during a cooling phase after the fusing-in exhibit a hardening effect which provides that in conjunction with the alloys, it is possible to produce compression glass lead-in arrangements which possess a hermetic sealing integrity even after a high degree of thermal and/or mechanical loading, have a high resistance to fluctuations in temperature and good resistance to corrosion.

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First Claim