Integrated circuit component package with integral passive component
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United States of America Patent
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May 27, 1997
Grant Date -
N/A
app pub date -
Dec 30, 1994
filing date -
Dec 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high-performance, high-density integrated circuit component package includes an IC chip having a plurality of IC bond pads and an interconnect substrate overlying the IC chip. The interconnect substrate includes a plurality of I/O surface pads arrayed across a surface of the interconnect substrate. The I/O surface pads are electrically connected to the IC bond pads via a plurality of traces internal to the interconnect substrate. The interconnect substrate further includes at least one layer comprising capacitive, resistive or inductive material integrally formed therein.
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