High-density electrical interconnect system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5634821
SERIAL NO

08464122

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electrical interconnect system includes a support element; and an array of groups of multiple electrically conductive contacts arranged on the support element such that at least one contact of each group includes a front surface facing outwardly and away from that group along a line initially intersected by a side surface of a contact from another one of the groups of the array. The groups may be arranged in a configuration such that the array has a density of at least 500, 600, or 1,000 contacts per square inch. One array may include groups of contacts (11) arranged around insulative buttresses (12), as shown in FIG. 5a, for example, and the other array may include groups of flexible beam contacts (31), as shown in FIG. 20, for example. Further, a group of contacts may include a zero-insertion-force component 60 having a bulbous member 64 for spreading apart the groups of contacts, as shown in FIGS. 24(a) and 24(b).

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Patent Owner(s)

  • HELIX (PEI) INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crane, Jr Stanford W 3934 NW. 57th St., Boca Raton, FL 33496 66 1252

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