Semiconductor device for mounting high-frequency element
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United States of America Patent
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Jun 3, 1997
Grant Date -
N/A
app pub date -
Nov 13, 1995
filing date -
Nov 11, 1994
priority date (Note) -
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Abstract
A semiconductor device includes a base case 12, a first conductive pattern 6 selectively formed on the base case 12 a semiconductor element 1 mounted on the first pattern 6, a second conductive pattern 7 selectively formed on the base case 12 and connected to a first electrode 2 of the semiconductor element 1, the second conductive pattern 7 being separated from the first conductive pattern 6 to form a first parasitic capacitance therebetween, and a third conductive pattern 8 selectively formed on the base case 12 and connected to a second electrode 3 of the semiconductor element 1, the third conductive pattern 8 being separated from the first conductive pattern 6 to form a second parasitic capacitance therebetween, the first parasitic capacitance being larger than the second parasitic capacitance.
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