Internal resistor termination in multi-chip module environments

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United States of America Patent

PATENT NO 5635761
SERIAL NO

08355876

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Abstract

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Thin-film conductor technology is utilized to form resistors of precisely controlled value within the interior of multi-chip modules to properly terminate network circuits which interconnect one or more chips with either output pin connections or other chips on the multi-chip module. By forming and disposing the resistors within the interior of the multi-chip module, the terminating resistors may be manufactured during the multi-chip module manufacturing process. This approach preserves valuable surface area available for interconnecting the computer chips to the multi-chip module rather than consuming scarce surface area with termination resistors and other circuit elements necessary to adapt the multi-chip module and the other computer chips to each other.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Tai A Austin, TX 7 137
Stoller, Herbert I Wappingers Falls, NY 23 616
Trinh, Thanh D Austin, TX 8 177
Walls, Lloyd A Austin, TX 30 298

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