Variable capacitor formed by multilayer circuit board
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United States of America Patent
Stats
-
Jun 3, 1997
Grant Date -
N/A
app pub date -
May 19, 1995
filing date -
May 31, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A variable capacitor for a high frequency circuit of an electrical appliance includes a chip capacitor mounted on a multilayer circuit board and interdigital capacitors formed at inner layers of the circuit board. A wiring pattern for soldering the chip capacitor is connected with the interdigital capacitors via through holes formed in the circuit board. Capacitance select portions are cut so that the capacitance best-suited to the circuit is obtained. The through holes connected to the interdigital capacitors of the inner layer are selectively disconnected from the wiring pattern for soldering the chip capacitor, thereby obtaining a variable capacitor capable of absorbing fluctuations of the circuit for selecting the best-suited capacitance.
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