Manufacturing flexible circuit board assemblies with common heat spreaders
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United States of America Patent
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-
Jun 17, 1997
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Jun 3, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.
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