Process for producing a printed wiring board
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United States of America Patent
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-
Jun 17, 1997
Issued Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 17, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.
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Cited Art Landscape
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