On-chip temperature sensing system
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United States of America Patent
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Jun 17, 1997
Grant Date -
N/A
app pub date -
Nov 14, 1994
filing date -
Nov 14, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A pair of on-chip thermal sensing diodes are formed together and interconnected with a common cathode to form a differential sensing pair. A pair of precision resistors external to the chip generates two constant currents, one for each diode, with a ratio of one to the other on the order of 100 to 1. The precision resistor values are selected so that variations about the nominal values of metal and via resistances between the diode contacts and the chip contact pads (e.g. C4 contacts) are negligible compared to the precision resistor values. Leads, connected respectively to two pads on the chip, couple a differential output of the anode voltages of the diode pair to the input of a high impedance amplifier.
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