Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 17, 1997
Issued Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Jan 13, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully