Method of molding a resin article with an embedded workpiece
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United States of America Patent
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Jun 17, 1997
Grant Date -
N/A
app pub date -
Feb 21, 1995
filing date -
Feb 23, 1994
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A molded article is formed by an injection molding method of embedding a workpiece within a resin by the use of a mold. The mold has a mold cavity, at least one supporting pin removably projecting into the mold cavity to support the workpiece in the mold cavity, and at least one gate for injecting the resin into the mold cavity. The supporting pin is forced against the workpiece to support the workpiece within the molded cavity. The resin is injected into the molded cavity through the gate. In the present method, the supporting pin is removed from the mold cavity after the workpiece is supported by pressure of the resin injected in the mold cavity. The injection of the resin is continued to fill a hole left in the mold cavity by removal of the supporting pin. After the injection is finished, the injected resin is hardened to obtain the molded article. This method is useful for integrally molding a conductive member with an electrically insulating resin to form a component of an electrical device, for example, a base plate or cover plate of an electrical rotary switch for detecting positions of an automatic transmission of an automobile.
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