US Patent No: 5,640,051

Number of patents in Portfolio can not be more than 2000

Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex

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Importance

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Abstract

A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.OSAKA27275

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bessho, Yoshihiro Higashiosaka, JP 54 1362
Hakotani, Yasuhiko Nishinomiya, JP 14 240
Tomura, Yoshihiro Hirakata, JP 54 427

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
5,316,788 Applying solder to high density substrates 73 1991
5,239,448 Formulation of multichip modules 176 1991
5,404,044 Parallel process interposer (PPI) 135 1993
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
4,714,570 Conductor paste and method of manufacturing a multilayered ceramic body using the paste 17 1985
5,004,640 Multilayered ceramic substrates and method for manufacturing the same 30 1989
5,408,121 Semiconductor device, an image sensor device, and methods for producing the same 15 1993
 
FREESCALE SEMICONDUCTOR, INC. (2)
5,241,133 Leadless pad array chip carrier 173 1992
5,397,917 Semiconductor package capable of spreading heat 145 1993
 
HITACHI, LTD. (2)
4,825,284 Semiconductor resin package structure 115 1986
5,281,151 Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module 149 1992
 
EASTMAN KODAK COMPANY (1)
5,213,676 Method of generating a substrate electrode for flip chip and other applications 20 1992
 
HUGHES AIRCRAFT COMPANY (1)
5,426,072 Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate 233 1993
 
MITSUI MINING & SMELTING CO., LTD. (1)
5,118,386 Printed circuit board having bumps and method of forming bumps 36 1989
 
NGK SPARK PLUG CO., LTD. (1)
5,196,089 Multilayer ceramic substrate for mounting of semiconductor device 7 1991
 
NIPPON MEKTRON, LTD. (1)
5,260,518 Multilayer circuit board for mounting ICs and method of manufacturing the same 43 1991
 
OL SECURITY LIMITED LIABILITY COMPANY (1)
5,315,239 Circuit module connections 12 1991

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
SALMON TECHNOLOGIES, LLC (4)
7,505,862 Apparatus and method for testing electronic systems 0 2003
7,408,258 Interconnection circuit and electronic module utilizing same 0 2004
7,427,809 Repairable three-dimensional semiconductor subsystem 7 2004
7,586,747 Scalable subsystem architecture having integrated cooling channels 5 2006
 
FUJITSU LIMITED (3)
6,038,135 Wiring board and semiconductor device 3 1996
6,482,676 Method of mounting semiconductor chip part on substrate 25 1997
6,429,516 Structure for mounting a bare chip using an interposer 28 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
6,222,276 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections 22 1998
6,150,726 Component carrier with raised bonding sites 30 1998
6,410,431 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections 42 2000
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
6,103,551 Semiconductor unit and method for manufacturing the same 22 1997
6,452,280 Flip chip semiconductor apparatus with projecting electrodes and method for producing same 8 1998
6,538,315 Semiconductor device and method of manufacturing same 3 2000
 
HITACHI CHEMICAL COMPANY, LTD. (2)
7,205,645 Wiring board, semiconductor device, and method of manufacturing wiring board 5 2001
7,704,799 Method of manufacturing wiring substrate 0 2007
 
KABUSHIKI KAISHA TOSHIBA (2)
5,998,861 Semiconductor device having ball grid array 26 1996
5,834,848 Electronic device and semiconductor package 94 1997
 
ROUND ROCK RESEARCH, LLC (2)
6,998,344 Method for fabricating semiconductor components by forming conductive members using solder 40 2004
6,952,054 Semiconductor package having interconnect with conductive members 22 2004
 
XILINX, INC. (2)
7,566,960 Interposing structure 5 2003
8,062,968 Interposer for redistributing signals 1 2009
 
AGILENT TECHNOLOGIES, INC. (1)
7,911,066 Through-chip via interconnects for stacked integrated circuit structures 0 2007
 
AMKOR TECHNOLOGY, INC. (1)
5,915,169 Semiconductor chip scale package and method of producing such 75 1996
 
APPLE INC. (1)
5,914,535 Flip chip-on-flip chip multi-chip module 11 1998
 
ATMEL CORPORATION (1)
6,218,729 Apparatus and method for an integrated circuit having high Q reactive components 69 1999
 
DR, EKJE ZAKEL (1)
6,043,985 Thermal connecting structure for connecting materials with different expansion coefficients 8 1997
 
GENERAL DYNAMICS INFORMATION SYSTEMS, INC. (1)
5,986,339 Laminated multilayer substrates 24 1998
 
IBIDEN CO., LTD. (1)
7,847,318 Multilayer build-up wiring board including a chip mount region 0 2009
 
INTEL CORPORATION (1)
7,205,649 Ball grid array copper balancing 0 2003
 
MICRO-TEC COMPANY, LTD. (1)
6,264,097 Method for forming a solder ball 9 2000
 
NEC CORPORATION (1)
5,889,326 Structure for bonding semiconductor device to substrate 65 1997
 
OKI SEMICONDUCTOR CO., LTD. (1)
7,323,779 Semiconductor device 1 2005
 
RENESAS ELECTRONICS CORPORATION (1)
7,816,183 Method of making a multi-layered semiconductor device 0 2007
 
RICOH COMPANY, LTD. (1)
6,104,088 Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board 18 1998
 
SANDISK TECHNOLOGIES INC. (1)
7,138,583 Method and apparatus for maintaining a separation between contacts 2 2002
 
SATCON TECHNOLOGY CORPORATION (1)
6,084,296 Low cost high power hermetic package with electrical feed-through bushings 3 1998
 
SONY CORPORATION (1)
7,193,311 Multi-chip circuit module and method for producing the same 13 2004
 
TESSERA, INC. (1)
6,541,867 Microelectronic connector with planar elastomer sockets 14 2000
 
ULTRATERA CORPORATION (1)
6,897,566 Encapsulated semiconductor package free of chip carrier 4 2002
 
VLSI TECHNOLOGY, INC. (1)
6,069,407 BGA package using PCB and tape in a die-up configuration 96 1998
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
6,468,834 Method of fabricating a BGA package using PCB and tape in a die-up configuration 1 1999