Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
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United States of America Patent
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-
Jun 17, 1997
Grant Date -
N/A
app pub date -
Dec 9, 1994
filing date -
Dec 13, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.
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