Apparatus for checking glue application state

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United States of America Patent

PATENT NO 5641357
SERIAL NO

08540702

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Abstract

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The invention provides an apparatus for checking glue application state of almost electrically non-conductive object to which an electrically conductive glue is applied on either side thereof, including (a) an electrode for transmitting high frequency therefrom, (b) a pair of receiving electrodes each spaced from the high frequency transmitting electrode at its opposite sides, (c) a detector head for aligning distal ends of the electrodes at almost the same level and shielding the electrodes from one another, (d) a high frequency generator for supplying high frequency to the high frequency transmitting electrode, (e) a gluing condition detector for detecting gluing condition of the object on the basis of a difference in output between the receiving electrodes, and (f) a position adjuster for adjusting relative position between a glue applied to the object and each of the electrodes. Outputs of the receiving electrodes contains almost the same amount of noise, and thus it is possible to eliminate noise by calculating a difference in output between the receiving electrodes. Thus, the present invention ensures more accurate detection of the gluing condition of an object.

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Patent Owner(s)

Patent OwnerAddress
NIRECO CORPORATION2951-4 ISHIKAWA-MACHI HACHIOJI-SHI TOKYO 192-8522

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasahara, Toshiyuki Hino, JP 3 15
Kawamura, Kazuo Hachioji, JP 34 655
Moriya, Minoru Uenohara-machi, JP 21 99
Yamada, Takeo Yokohama, JP 95 1432
Yoshikawa, Hironobu Hachioji, JP 10 110

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