Method of manufacturing members

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5641714
SERIAL NO

08585776

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

According to the present invention, a method of manufacturing members, with a plurality of members being formed together on a single substrate and the substrate being cut in such a manner as to be divided into individual members after a characteristic evaluation of the members is carried out, comprises the steps of, carrying out the evaluation of the characteristics and applying ink marks of a prescribed height to surfaces of members deemed to have been defective, affixing a protective tape having an adhesive layer of a thickness equal to or greater than the height of the ink marks, to the surface of the substrate and cutting the substrate in such a manner as to be divided into individual members after a lower surface of the substrate has been ground or polished.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 1080075 ?1080075

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamanaka, Hideo Kanagawa, JP 57 2823

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation