Plastic-encapsulated semiconductor device
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United States of America Patent
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Jun 24, 1997
Grant Date -
N/A
app pub date -
Sep 13, 1994
filing date -
Sep 14, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
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