Method of manufacturing a hybrid integrated circuit component having a laminated body

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5643804
SERIAL NO

08242813

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
Semiconductor Energy Laboratory Co., Ltd.KANAGAWA-KEN11113
TDK CORPORATIONTOKYO, JP3984

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Michio Tokyo, JP 143 3389
Nagano, Katsuto Kanagawa, JP 32 656
Sakamoto, Naoya Kanagawa, JP 71 1254
Yamauchi, Yukio Kanagawa, JP 77 2058

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation