Method of manufacturing a hybrid integrated circuit component having a laminated body

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5643804
SERIAL NO

08242813

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
Semiconductor Energy Laboratory Co., Ltd.KANAGAWA-KEN10848
TDK CORPORATIONTOKYO, JP3999

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Michio Tokyo, JP 141 3274
Nagano, Katsuto Kanagawa, JP 32 645
Sakamoto, Naoya Kanagawa, JP 67 1179
Yamauchi, Yukio Kanagawa, JP 76 1870

Cited Art Landscape

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Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
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Other [Check patent profile for assignment information] (1)
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* Cited By Examiner