Carriers for IC packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 1, 1997
Grant Date -
N/A
app pub date -
Aug 21, 1995
filing date -
Aug 21, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.
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