Method of fabricating a focal plane array for hybrid thermal imaging system
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United States of America Patent
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Jul 8, 1997
Grant Date -
N/A
app pub date -
Jan 3, 1995
filing date -
Jan 3, 1995
priority date (Note) -
Expired
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Abstract
A hybrid thermal imaging system (20, 120) often includes a focal plane array (30, 130), a thermal isolation structure (50, 150) and an integrated circuit substrate (60, 160). The focal plane array (30, 130) includes thermal sensitive elements (42, 142) formed from a pyroelectric film layer (82), such as barium strontium titanate (BST). One side of the thermal sensitive elements (42, 142) may be coupled to a contact pad (62, 162) disposed on the integrated circuit substrate (60, 160) through a mesa strip conductor (56, 150) of the thermal isolation structure (50, 150). The other side of the thermal sensitive elements (42, 142) may be coupled to an electrode (36, 136). The various components of the focal plane array (30, 130) may be fabricated from multiple heterogenous layers (74, 34, 36, 82, 84) formed on a carrier substrate (70).
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