Substrate transfer apparatus, and method of transferring substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5645391
SERIAL NO

08455662

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TOKYO ELECTRON LIMITEDTOKYO5195

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohsawa, Tetu Sagamihara, JP 4 81
Tateyama, Kiyohisa Kumamoto, JP 70 1911

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
8428706 Sheet conductance/resistance measurement system 0 2006
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KABUSHIKI KAISHA YASKAWA DENKI (1)
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TOKYO ELECTRON LIMITED (5)
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* 8545158 Loading unit and processing system 1 2012
* 9627238 Substrate transfer apparatus, substrate transfer method, and storage medium 0 2013
* Cited By Examiner